Transfer Chamber & Robot Arm

Standard octagonal chamber, pumped by cryopump, ultimate vacuum 8×10⁻⁵Pa. Substrate loading/unloading positioning accuracy ±0.2mm

Loadlock Chamber

Ultimate vacuum 8×10⁻⁵Pa, standard 10-layer cassette for substrates and MASK

Evaporation Chamber

10 evaporation sources, cryopump, ultimate vacuum 4×10⁻⁵Pa. Substrate stage mechanical alignment accuracy ±0.2mm, CCD alignment accuracy ±5μm

IBS Chamber

High-power laser coatings, precision optical coatings

High-Temperature Evaporation Chamber

6 evaporation sources, cryopump, ultimate vacuum 4×10⁻⁵Pa. Substrate stage mechanical alignment accuracy ±0.2mm

PECVD Chamber

For thin film encapsulation of substrates, SiNx and other films available

Magnetron Sputtering Chamber

For ITO transparent electrodes or Al electrodes by sputtering

ALD Chamber

Al₂O₃ thin films for substrate encapsulation

Rotation Chamber (90°/180°/270°)

Shared vacuum system with transfer chamber, for substrate orientation adjustment

Flip Chamber (180°)

Shared vacuum system with transfer chamber, for substrate flipping

Heating & Baking Chamber

Heating and degassing of substrates or MASK

Glovebox & Auxiliary Equipment (metrology, dispensing, lamination, etc.)

Encapsulation and testing under N₂ protection after substrate unloading

Integrated Control & Peripheral Systems

System control and utilities (water, electricity, gas) for stable operation

No.

Test Data 1

Test Data 2

Test Data 3

1

760.1

1090.95

673.8

2

777.95

1106.5

679.4

3

774.6

1115.25

688.15

4

788.4

1131.6

692

5

800.8

1142.9

697

6

799.4

1140.45

698.8

7

797.05

1130.4

694.55

8

788.7

1115.05

690.3

9

776.75

1105.85

686.7

10

762.95

1106.75

678.05

11

747.3

1088.35

669.6

12

775.95

1087.55

704.85

13

777

1093

689.7

min

747.3

1087.55

669.6

max

800.8

1142.9

704.85

uniformity

0.03456

0.02482

0.02565