Main Structure
It consists of subsystems including load lock chamber, process chamber, unload chamber, return system and control system. The evaporation sources are equipped with point sources/linear sources, and the sputtering targets are equipped with planar/cylindrical targets.
Basic Configuration & Functions
|
Basic Configuration |
Main Parameters & Functions |
|
Substrate Size |
Tray-mounted: Max. 1.2×2.4m, compatible with smaller sizes; |
|
Ultimate Vacuum |
8×10⁻⁵Pa; (Clean empty chamber, continuous pumping for 24 hours) |
|
Leak Rate |
≤5×10⁻⁹Pa·m³/s (Helium leak rate) / Pressure holding ≤5Pa for 12 hours |
|
Evaporation Rate Stability |
≤5%@1Å/s@95%sample |
|
Film Thickness Uniformity |
≤5% |
|
Transmission System |
Servo motor drive, repeatability within 2mm |
|
Film Thickness Control |
In-line quartz crystal + film thickness gauge for automatic control of film thickness and rate; 12-channel crystal oscillator ensures film thickness accuracy and long-term operation |
|
Electrical & Software |
Adopts PLC+PC mode; Fully automatic operation software with programmable coating process menu, different user permissions and data storage |