Thermal Evaporation Coating System (For BeSearch)-Pan-semiconductor-GLLITEK CORPORATION WELCOME TO INQUIER

Basic Configuration & Functions

No.	Basic Configuration	Main Parameters & Functions
-	Evaporation Source: Boat Source	Capacity: 1–3CC, Tungsten wire + AlN/Al₂O₃.
-	Evaporation Source: Beam Source	Capacity: 5, 10CC, Tantalum wire + Al₂O₃/PBN crucible; Temperature range: RT–500°C, Accuracy: ±1°C.
1	Film Thickness System	Inficon SQC–310 Film Thickness Monitor + 2 sets of crystal oscillation probes, Rate accuracy: 0.1 Å/s, Thickness accuracy: 1 Å.
2	Substrate Stage	Max substrate size: 300mm×300mm, with rotation function; Equipped with heating or water cooling (optional).
3	Vacuum System	Turbo pump + mechanical pump with bypass pumping system, chamber venting without stopping main pump (cryopump optional).
4	Control System	PLC+PC or PLC+touch screen for automatic program operation. Includes one-click pumping and venting functions, and misoperation interlock protection.
5	Glovebox	(Optional) Connectable to the coating equipment for substrate handling in water-free and oxygen-free environment.
6	Sample Chamber	(Optional) Vacuum robot for substrate loading/unloading without breaking process vacuum.

✔ Substrate Sizes Available: 100×100mm, 210×210mm, 300×300mm, etc.; Suitable for evaporation coating of medium-low temperature metals (Ag, Au, Al, In, etc.), compounds (LiF, SnO) and organic materials.

Equipment Introduction - Test Data

Evaporation source during heating

Rate stability

Substrate Uniformity: < 5% on the diagonal of 300×300mm substrate

Basic Configuration & Functions
Max substrate size: 300×300mm; Suitable for depositing medium-high temperature metals (Ti, Ni, Ag, etc.) and oxides (SiO₂, Al₂O₃, etc.) thin films.

Internal structure of chamber

Internal view of vacuum chamber

Electron beam evaporation source

Thermal resistance evaporation source

Heated substrate holder

Basic Configuration & Functions

Basic Configuration	Main Parameters & Functions
Electron Beam Source	Imported e-gun with 4 or 6 pockets, rotary switching. Film thickness uniformity >95%.
Thermal Evaporation Source	Single or multiple thermal evaporation sources (boat or crucible), DC power supply. Film thickness uniformity >95%.
Vacuum System	Turbo pump + mechanical pump with bypass pumping system. Chamber venting without stopping main pump (cryopump optional).
Control System	PLC+PC or PLC+touch screen, automatic program control. Film thickness controller enables automatic evaporation rate control.
Glovebox	(Optional) Integrated with coater for substrate handling in water-free and oxygen-free environment.
Sample Chamber	(Optional) Vacuum robot for substrate loading/unloading without breaking process vacuum.

In addition to the main e-beam coater, a glovebox and sample chamber can be configured to enable substrate handling in nitrogen or vacuum environment.