Basic Configuration & Functions
| Basic Parameters | Specifications |
| Ultimate Vacuum | 4E-5 Pa (under clean empty chamber, continuous pumping for 24h) |
| Leak Rate | ≤5E-9 Pa·m³/s (Helium leak rate) / Pressure holding ≤5 Pa for 12h |
| Pressure Control Accuracy | 0.1 Pa (process pressure range: 0.2–2 Pa) |
| Film Thickness Uniformity | ≤5% ((Max-Min)/(Max+Min)) |
Coating Data – Laser Film
| No. | Basic Configuration | Main Parameters & Functions |
| 1 | Cathode Source | Available in 2.5", 3", 4", 6", 8", 12". Pneumatic shutter, angle adjustable. |
| 2 | Substrate Holder | Max. substrate size 210mm×210mm. Rotation & lifting; heating or water cooling (select one). |
| 3 | Vacuum System | Turbomolecular pump + mechanical pump with bypass system. Chamber can be vented without stopping main pump (cryopump optional). |
| 4 | Control System | PLC+PC or PLC+touch screen, automatic program control. One-key pump & vent function. |
| 5 | Glovebox (Optional) | Can be integrated with coater for substrate loading/unloading in water-free & oxygen-free environment. |
| 6 | Sample Chamber (Optional) | Vacuum manipulator for substrate handling, allowing loading/unloading without breaking process chamber vacuum. |